Symposium News - Get Updated! 

Important Dates Description
October 26th, 27th and 28th, 2020 The BTSym'20 event will be held from 9:00am to 10:00pm.

October 1st,2020 

October 15th, 2020 

Call-for-papers deadline.
October 28th, 2020 Registration deadline.
The Proceedings will be published at the end of Aug. 2021 Proceedings publication. 





The BTSym'20 organizing committee invites researchers to attend and submit papers addressing the current research topics of interest. In 2020, the event after three days in duration, on October 26th, 27th and 28th, at the PUC University, Campinas-SP. Proceedings of the event will be published by the Springer Nature publisher through the book Proceedings of the 6th Brazilian Technology Symposium - Emerging Trends and Challenges in Technology, and this book will be published in the series "Smart Innovation, Systems and Technologies".

Indexing: The books of this series "Smart Innovation, Systems and Technologies" are submitted to ISI Proceedings, EI-Compendex, SCOPUS, Google Scholar and Springerlink.

This event seeks to bring together researchers, students and professionals from the industrial and academic sectors, seeking to create and/or strengthen the linkages between issues of joint interest. Participants are invited to submit research papers, case studies, articles of opinion or posters, showing studies, methodologies and results achieved in scientific level research projects, completion of course work for graduation, dissertations and theses.

The event accepts articles from scientific research and university extensions.

 Discussion Panel 1: Technology and industrial processes.


  • Industrial technological processes.
  • Technology applied to production processes.
  • Innovation models.
  • Digital factory.
  • Quality 4.0.
  • Logistics 4.0.
  • Innovation 4.0.
  • Clean technologies.
  • Industrial automation.
  • Engineering Process Simulations.


Discussion Panel 2: Applied Robotics.and Real Time Signal Processing.


  • Microelectronics and MEMS for Mobile Systems.
  • Analog Microelectronic Chip: Conception and design.
  • Digital Microelectronic Chip:Conception and Design.
  • Wireless Microelectronic Chip: UWB ( Ultra Wide Band) Transmitter and Receiver design.
  • Integrated Mixed ( Analog, Digital , and Wireless) chip for RT-SHM ( Real-Time Structural Health Monitoring) Chip.
  • Radiation Effects on Electronic Components and Sub-systems.
  • Digital Big Data Processing in Mobile Embedded Systems.
  • Large-scale networks and Smart Grids Systems, Conception and Design.
  • Cyber-physical Security of Large-scale Networks and Smart Grids.
  • IoT enabled smart grid architectures, models and protocols.
  • Communication networks for smart grids and smart metering Advanced measurement infrastructure networks (AMI).
  • Sensor, actuator and machine to machine (M2M) for smart grid and micro-grids.
  • Reliability, availability, resilience and robustness of the smart grid; Intelligent data security network, mobility.
  • Data security Simulation and performance analysis of communications and smart grid operations: Real-time networks.
  • Cyber Physical Electronics for Medicine: Controlled energy transfer to surgical devices.
  • Fast Processing and Robust Control of mobile Systems, by Simulation, FPGA Prototyping, and Application of Machine Learning.
  • AI-Induced Meta-models of Flexible Air-Space Mobile Vehicles.
  • Radar System and Algorithms.
  • Autonomic Intelligent Systems: Collaborative Systems, Nanosatellite Related Electronics. 


Discussion Panel 3: Technology applied to buildings.


  • Construction 4.0.
  • Automation and Robotics in buildings.
  • Environmental comfort.
  • Energy efficiency in buildings.
  • Constructions.
  • Technologies in Design, BIM.
  • Construction Information Model, Provisional and adapted constructions. 
  • Sensors applied to civil construction.
  • Sustainable buildings.
  • Smart buildings.


Discussion Panel 4: Product Development and Innovation.


  • Sustainable Development and Environmental Management.
  • Economic engineering.
  • Organizational Engineering.
  • Factory Project.
  • Lean manufacturing.
  • Integrated management system.
  • Quality.
  • Metrology.
  • Manufacturing Automation and Strategic Management.


Discussion Panel 5: Telecommunications, product development and innovation in mobile systems.


  • New products and services.
  • Mobile systems for 4G and 5G cell phones.
  • Visual computing.
  • Image and video processing.
  • Machine learning.
  • Human-computer interaction using image processing.
  • Image processing for real-time control.
  • Medical image processing, new generation of digital TV.
  • Digital TV interactivity.
  • Broadband and transmission systems.


Discussion Panel 6: Technologies applied to urban infrastructure.


  • Smart Cities.
  • Urban environmental comfort.
  • Technologies applied to urban planning.
  • Technology and management of urban infrastructure.
  • Innovation and technology in the urban environment.
  • Intelligent technology and transport.
  • Urban monitoring.


Discussion Panel 7: Applied Biomedicines. 


  • Medicine.
  • Covid-19.
  • Dentistry.
  • Biology.
  • Biomedicine.
  • Nursing.
  • Medicines and Vaccines.









The Brazilian Technology Symposium respectfully asks scholars and experts in BTSym areas to consider being a member of the Reviewers Committee. If you are interested or if you have someone to recommend, please send CV to This email address is being protected from spambots. You need JavaScript enabled to view it.. We’ll have each CV carefully reviewed and select most suitable ones for BTSym. 


Organizing and Executive Committee

  • Yuzo Iano - LCV/DECOM/FEEC/UNICAMP - General Chair BTSym & WSGE
  • Osamu Saotome - ITA - Associate-General Chair BTSym
  • Rangel Arthur - FT/UNICAMP Vice-General Chair BTSym
  • Ana Cláudia Seixas - LCV/DECOM/FEEC/UNICAMPVice-Associate-General Chair BTSym
  • Claudia Cotrim Pezzuto - PUC/UNICAMP - Vice-Associate-General Chair BTSym
  • Luiz Vicente F. de Mello Filho - Universidade Presbiteriana Mackenzie - Campinas - Vice-Associate-General Chair BTSym
  • Paulo Roberto dos Santos - UniMetrocamp - Vice-Associate-General Chair BTSym
  • Raquel J. Lobosco - UFRJ Vice-Associate-General Chair BTSym
  • João Carlos Gabriel - Universidade Presbiteriana Mackenzie - Campinas - Vice-Associate-General Chair BTSym
  • Gabriel Gomes de Oliveira LCV/DECOM/FEEC/UNICAMP - Technical Program and Finance Chair  
  • Telmo Cardoso Lustosa - LCV/DECOM/FEEC/UNICAMP - Local Arrangements Chair
  • Alysson Gomes de Oliveira - LCV/DECOM/FEEC/UNICAMP - Marketing Chair 
  • Diego Arturo Pajuelo Castro - LCV/DECOM/FEEC/UNICAMP - Proceedings Chair
  • Abel Dueñas Rodríguez - LCV/DECOM/FEEC/UNICAMP - Midia Chair
  • Alex Rodriguez Ruelas - LCV/DECOM/FEEC/UNICAMP - Proceedings Chair
  • David Minango - LCV/DECOM/FEEC/UNICAMP - Institutional Relationship Chair
  • Lisber Arana - LCV/DECOM/FEEC/UNICAMP - Institutional Relationship Chair
  • Maria Cecilia Luna - LCV/DECOM/FEEC/UNICAMP - Proceedings Chair
  • Thais Paiao - LCV/DECOM/FEEC/UNICAMP - Institutional Relationship Chair
  • Daniellle Thiago Ferreira - LCV/DECOM/FEEC/UNICAMP - Editorial Committe Chair
  • Elizangela Santos Souza - LCV/DECOM/FEEC/UNICAMP - Editorial Committe Chair
  • Jennifer Chuin Lee - LCV/DECOM/FEEC/UNICAMP - Designer Chair
  • Airton Vegette - LCV/DECOM/FEEC/UNICAMP - Institutional Relationship Chair
  • Angélica F. G. - LCV/DECOM/FEEC/UNICAMP - Institutional Relationship Chair
  • Daniel B. Katze - LCV/DECOM/FEEC/UNICAMP - Institutional Relationship Chair
  • Gabriel Caumo Vaz - LCV/DECOM/FEEC/UNICAMP - Institutional Relationship Chair
  • Lucas Alves - LCV/DECOM/FEEC/UNICAMP - Institutional Relationship Chair
  • Leticia Cursi - LCV/DECOM/FEEC/UNICAMP - Institutional Relationship Chair
  • Mariana Melo - LCV/DECOM/FEEC/UNICAMP - Institutional Relationship Chair
  • Ubiratan Matos - LCV/DECOM/FEEC/UNICAMP - Institutional Relationship Chair


Contact BTSym Support

If you have any need for additional information, doubts, concerns and/or system issues please feel free to contact the Editorial Office via email. Email Address: This email address is being protected from spambots. You need JavaScript enabled to view it.